JPH02106838U - - Google Patents
Info
- Publication number
- JPH02106838U JPH02106838U JP1602889U JP1602889U JPH02106838U JP H02106838 U JPH02106838 U JP H02106838U JP 1602889 U JP1602889 U JP 1602889U JP 1602889 U JP1602889 U JP 1602889U JP H02106838 U JPH02106838 U JP H02106838U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- wire bonding
- depressions
- entrance
- wider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1602889U JPH02106838U (en]) | 1989-02-13 | 1989-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1602889U JPH02106838U (en]) | 1989-02-13 | 1989-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106838U true JPH02106838U (en]) | 1990-08-24 |
Family
ID=31228600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1602889U Pending JPH02106838U (en]) | 1989-02-13 | 1989-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106838U (en]) |
-
1989
- 1989-02-13 JP JP1602889U patent/JPH02106838U/ja active Pending
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